DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Competence in micro assembly solutions

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BREAKING NEWS

NEW PRODUCT SERIES LAUNCHED

The T-5000series Die Bonder is what we would like to call an evolution. The result of 40 years experience in developing high quality Die Bonder is based on a new frame concept and fulfils highest requirements for up- to-date applications in R&D and small scall productions of the worldwide microelectronic industry.

With increased travel range and our TRUE VERTICAL TECHNOLOGY, higher rigidity, increased image quality and new T-Suite software features, the T-5000serie achieves repeatable accuracy not compromising the proved flexibility and ergonomics.

T-5300

T-4909-AE

The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated embedded PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.

Click here to see more and download the datasheet

Online Product Demonstration

We would be happy to give you the opportunity to get to know our Tresky chip bonding solutions at a virtual machine demonstration in our brand new showroom. We are equipped and ready for you. To make an appointment, please contact:

Tel. +41 44 772 19 41
tresky_at_tresky.com

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Trade shows 2024

Show

Date

Location

Hall / Booth

NEPCON 24 - 26 January Japan | Tokyo Tokyo Big Sight, Hall 3, Booth E32-1A | Technoalpha
THERMAL24 IMAPS 31 January - 01 February France | La Rochelle Mercure Oceanide | Accelonics France
SEMICON Korea

31 January - 02 February

Korea | Seoul COEX, Booth C128 | 3H Corporation Ltd.
APEC 26 -28 February USA | Long Beach | CA Long Beach Convention Center | Tresky Corp.
SEMICON China 20 - 22 March China | Shanghai Shanghai New International Expo Centre | MPS
Fast - Engineering Solutions Live 21 March UK | Gaydon British Motor Museum | Inseto
MicroTech24 IMAPS 10 April UK | Bristol Aerospace Bristol, Patchway | Inseto
Battery Tech Expo 25 April UK | Silverstone The Wing, Silverstone Circuit, Booth B19 | Inseto
PCIM 11 - 13 June

Germany | Nuremberg

NuernbergerMesse Hall5 / Booth 326 | Dr. Tresky AG
NordPac IMAPS 11 - 13 June Finland | Tempere Scandic Rosendahl | Inseto
JPCA 12 - 14 June Japan | Tokyo Tokyo Big Sight, | Technoalpha
MiNaPad IMAPS 19 - 20 June France | Grenoble Convention Centre Grenoble | Accelonics France
NEPCON 19 - 22 June Thailand | Bangkok BITEC, Bangkok | Isodynamique
UK Semiconductors 2024 08 - 09 July UK | Sheffield Sheffield Hallam University | Inseto
CPE2024 08 - 09 July UK | Newcastele

Civic Centre, Barras Bridge, Newcastle | Inseto

EMAX 24 - 26 July Malaysia | Penang SPICE Penang International Sports Arena, Penang | Isodynamique
SEMICON Taiwan 04 - 06 September Taiwan | Taipei TaiNEX Hall 1 / Booth M1058 | Bondtronics
IMAPS 01 - 02 October USA | Boston | MA Encore Boston Harbor Resort | Tresky Corp.

We are happy to meet you!