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Hybrid MCM / COB SMD Flip - Chip RFID Opto Electronic Sensor Assembly 3D-Packaging Engineering
Welcome to Dr. Tresky AG and thank you for your interest in our products and services!

Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.

Over 900 units throughout the world have been installed to meet critical process and placement requirements.

Our worldwide network of distributors provides the technical support for our customers.

Dr. Tresky AG
designs and manufacture high quality equipment for :

Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...

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