Flip-Chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology which flip chip is replacing, uses face-up chips with a wire connection to each pad. Tresky’s modular die bonding equipment with the most common Flip-Chip option, based on a beam-splitter vision system, allows high accuracy placement by one ore multiple points.
Flexibility
Tresky’s T-3x0x line allows different Flip-Chip bonding processes, such as soldering, adhesive or ultrasonic bonding. Process parameters can be easely adjusted for optimized results. Temperature, time and force can be adjusted respectively programmed independently.
Required Technical Data
Accuracy: up to 5micron (or better)
Bonding Parameters: 20g - 100g bond force per bump according process technology
Temperature: 120°C - 400°C according process technology
In the C4 process (Controlled Collapse Chip Connection), the chip bumps are soldered onto the package substrate for electrical connection.
Process - Eutectic
Eutectic soldering process for Au/ Sn bumped dies, especially suitable for optoelectronic and RF devices.
Process - Adhesive Technology
Dispense ACP or NCP glue on substrate. Bumped chip, aligned by beam splitter, placed into glue and cured.
Used for complete bottom side encapsulated Flip-Chip, mainly with an epoxy based material.
Process - Ultrasonic
During placement, the energy required for the welding process comes in the form of mechanical vibrations.
Tresky’s T-3x0x modular line enables an easy changeover from one to another product within minimal steps, even between different process technologies, therefore ideal for R&D. The highly ergonomic and user friendly Tresky line is also suitable for medium production volume.
JUST PLACE IT!
