Most RFID (Radio-frequency identification) tags contain at least two parts. One is an integrated circuit for storing and processing information, modulating and demodulating a (RF) signal, and other specialized functions. The second is an antenna for receiving and transmitting the signal. Tresky’s modular die bonding equipment delivers, once more, optimal perfomance in R&D and pre-production assembly as e.g.: Bonding of a Flip-Chip to Antenna.

Flexibility
Tresky’s T-3x0x line allows different RFID bonding processes, such as adhesive or ultrasonic bonding. Process parameters can be easely adjusted for optimized results. Temperature, time and force can be adjusted respectively programed independently.

Required Technical Data
Accuracy:             10micron (or less)
Bonding Parameters: Force 20g - 400g and time up to
                  2-4Sec. on final curing temperature.
Temperature:        Adjustable temp. profile for chip and
                 antenna up  to 200°C with ramping speed up
                 to 18°C/Sec. for adhesive technologies only.

Process - ACP Adhesive Technology
(ACP Anisotropic Conductive Paste)
Dispense ACP glue on antenna. Electroless bumped chip, aligned by beam splitter, placed into glue and cured.

Process - NCP Adhesive Technology
(NCP Non Conductive Paste)
Dispense NCP glue on antenna. Stud bumped chip, aligned by beam splitter, placed into glue and cured.

Process - Ultrasonic
During placement, the ultrasonic energy is transfered to the chip contacs, where it is transformed into heat.

Tresky’s T-3x0x modular line enables an easy changeover from one to another product within minimal steps, even between different process technologies, therefore ideal for R&D. The highly ergonomic and user friendly Tresky line is also suitable for medium production volume.

JUST PLACE IT!

Recommended Tresky Items for RFID application:

Basic Machine:
T-3002-M or T-3002-FC3

RFID-Application-Package
consisting of:
- Microscope
- Flip-Chip IIa compl.
Field of view 1x1mm up to 4.6x4.6mm
Illumination
- PC with Windows Software and LCD monitor
- XY-Table Fine Adjustment and Locking Facility 04
- Eutectic 04 “Quick Heat” Heating Plate
- Tool Heating TOTc
- iTools Software
- 2 Temperature Controller ETU04