TRESKY adhesives, are focused on electronic adhesive devices and the electronic accesories. These adhesives are designed for improving process yield, enhencement of reliability, lower cost ownership. These includes surface mount assembly adhesives, non conductive adhesives and UV curable adhesives.
Type |
Description |
Curing |
Curing conditions |
Viscosity |
C.T.E |
Feature |
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| Name | |||||||||||||||
| DA90 | Conductive Adhesive | DA is a silver filled, highly electrically conductive, solvent-free and fast cure ... | Temp. Cure | 30-50min @ 90°C | 10-50 kcp | 35 | Thermal Conductivity 2-5W/mK |
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| DA150 | Conductive Adhesive | DA is a silver filled, highly electrically conductive, solvent-free and fast cure ... | Temp. Cure | 6-10min @ 150°C | 10-50 kcp | 35 | Volume resistivity 0.00003-0.00008Ω.cm |
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| DA150L | Conductive Adhesive | DA is a silver filled, highly electrically conductive, solvent-free and fast cure ... | Temp. Cure | 6-10min @ 150°C | 2-5 kcp | 32 | Thermal Conductivity >2.8W/mK |
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| DA150LE | Insulating Adhesive | DA...L.. is one-component, thermosetting insulating transparent ... | Temp. Cure | 60min @ 150°C | 5-10 kcp | 65 | Thermal Conductivity >0.4W/mK |
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| DA150LW | Insulating Adhesive | DA...L.. is one-component, thermosetting insulating transparent ... | Temp. Cure | 5-10min @ 150°C | 5-10 kcp | 25-30 | Thermal Conductivity >0.9W/mK |
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| TM150 | solderable conductive adhesives | TM... solderable conductive adhesives is rapid cure, self-filling ... | Temp. Cure | 5min @ 150°C | 500 kcp | 23,5 | Thermal Conductivity 60W/mK |
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| TM230 | solderable conductive adhesives | TM... solderable conductive adhesives is rapid cure, self-filling ... | Temp. Cure | 60sec @ 230°C | 30-45 kcp | 21.7 | Thermal Conductivity 58W/mK |
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| WL66O | Die Attach Adhesive | Dual cure UV bonding adhesive | UV Cure | 3-5sec | 3-6 kcp | α1=65 | Tg @ 120°C |
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| WL66H | Die Attach Adhesive | Low temp. thermal cure ... | Temp. Cure | 1,5-2hrs @ 100°C | 2-5 kcp | α1=65 | Transparent colorless liquid |
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| NCA88 | Non Conductive Adhesive | Non-conductive adhesive to bond to glass or metal. | Temp. Cure | In–line curing or 10-15min @ 80-90°C | 15-50kcp | α1=75 α2=182 | Lap Shear Strength 2000psi (FR4/FR4) |
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| NCA180 | Non Conductive Adhesive | Non-conductive adhesive for thermal compression | Temp. Cure | 10-30sec @ 180°C | 3-8 kcp | α1=21 α2=131 | Lap Shear Strength 4500psi (FR4/FR4) |
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| SMT256 | Dip Adhesive | Designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip-Chip ... | Temp. Cure | 4-5min @ 230°C | 10-50 kcp | First solder joint encapsulating adhesive |
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| SMT266 | Spray Adhesive | Designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip-Chip ... | Temp. Cure | 4-5min @ 230°C | 6-10 cp | First solder joint encapsulating adhesive |
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| SMT158 | Underfill | SMT... capillary underfill is a combination of capillary flow and no-flow underfill | Temp. Cure | In–line curing or 15min @ 150 °C | 3.5-8.0 kcp | α1=35 α2=142 | Lap Shear Strength 2600psi (FR4/FR4) |
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| SMT160 | Underfill | SMT... capillary underfill is a combination of capillary flow and no-flow underfill | Temp. Cure | In–line curing or 15min @ 165 °C | 1.5-2.5 kcp | α1=70 α2=272 | Lap Shear Strength 2480psi (FR4/FR4) |
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| SMT156 | Solderable Adhesive | SMT156 is rapid cure, self-leveling and self-soldering adhesive | Temp. Cure | 5min cure @ 150°C | 700-900 kcp | 23.5 | Electrical conductivity >1000000S/m |
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