Micro assembly apllications

Die Bonding of Devices with Copper Pillar Bumps Application

Flip chip technology is keeping pace with the increasing connection density of the ICs and is capable of transferring semiconductor performance to the printed circuit board. The pitch is growing smaller, which means flip chip technology with solder bumps will unavoidably run up against its technical limitations. The reason for this is the spherical geometry of the bumps. The solution to this problem is copper pillars. In this contact technology for flip chip assembly, special cylindrical copper connections function with a solder deposit instead of the usual solder ball bumps to form the connecting element between semiconductor and substrate. The result: improved reliability and enhanced electrical and thermal connection characteristics, greater connection density with narrow pitching and RoHS conformity.

Copper Pillar Bumps

Copper Pillar Bumps

Examples of typical applications and products with CPB technology:

Fine pitch ICs in extremely small housing forms for processors, fast memory components (DDR III), hearing aid and RFID solutions. Power MOSFETS requiring low resistance combined with thermal conductivity. High speed preamplifiers and RF modules requiring good thermal conductivity and high functional speeds. MEMS packages, due to large aspect ratios and stable bump geometries.

Solution:

The T‐3000/3002FC3‐A Series is Tresky’s most advanced accuracy die bonding platform delivering 1μm alignment accuracy using its’ “True Vertical™” technology. The technology delivers ONLY vertical movement of the bonding arm so, you do not have to insert shims or re‐adjust the spacing between your die and substrate if your substrate thickness changes (i.e. chip stacking applications). Just pick up the die from wafer frame/ring or waffle pack and the Z bonding arm will automatically move to your programmed alignment height. Engage the beam splitter optics which provides you with a high resolution, zoom‐able image for high accuracy alignment. Precisely align the die to the substrate using the fine micrometers and 360° of theta. Retract the optics and the motorized, programmable Z bonding arm with 1μm resolution bonds the die with either controlled force or to a specified height. Truly Vertical; Truly Simple.

T‐3000-FC3 / T-3002-FC3

T‐3000-FC3 / T-3002-FC3

FC09 or FC09 mpa Beam Splitter Optics

The FC09 Beam Splitter Optics allows simultaneous viewing of two objects optically overlayed. Using an optical shutter, each of the objects (upper, lower or both) can be simultaneously displayed on the monitor. The FC09 has a builtin zoom camera with a 23x optical magnification producing a field of view from 300μm up to 6.5mm. The module also has integrated LED lighting for optimal illumination of various substrates and components. In combination with the XY Microadjustment and Locking Facility, an alignment accuracy of up to 1μm can be achieved. The FC09 is also available in a Multiple Point Alignment (mpa) version with HD (highDefinition) which allows alignment with multiple points in X and Y.

Flip-Chip09mpa Beam-Splitter Optic

Flip-Chip09mpa Beam-Splitter Optic

Flux Dipping Station

The Flux Dipping Station is a motorized rotating container with a micrometer for the smoothing and distribution control of the flux. It is mounted onto the XY Table and the rotation is activated by moving the table to the back of system. The station is then moved beneath the collet for the device to be dipped into.

QH08 Quick heat Heating Plate with Inert Gas Chamber

The 20mm x 20mm QH08 Quickheat Heating Plate with 50mm x 50mm Inert Gas Chamber is a controlled heating and cooling system that can reach 400°C in up to 18k/s. The substrate is placed down onto the vacuum controlled heating plate and the chamber is closed to purge the area with forming or insert gas that is controlled by the flow controller. The assembly’s ramp rate, dwell time, cooling rate and complete temperature profile is programmed and controlled through the iTools software. This provides you with the visibility to maximize the eutectic profile. The program is activated by the T‐3000/3002FC3‐A when it reaches either the bonding height or force. Alignment occurs using the True Vertical™ Technology with visibility right down into the chamber using the FC09 Beamsplitter optics. After alignment, the optics are retracted and the device is placed right through the hole in the chamber cover and down to the substrate.