T-Chipex1
System for removal of adhesive attached Semiconductor and SMD devices. It provides a fast and exact positioning of the component to be removed, pre-heating of the whole substrate, focused heating of the defective device and building-up of a shear force, necessary for the separation of the component. Depending on component size, the acting of the force can be static, dynamic or combined static and dynamic.
T-Chipex 1
