manual micro assembly

T-4909 Budget sensitive Manual Die Bonder

The T-4909 is a manual, high quality  die bonder with superior ergonomic design.  As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

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T-4909 Key Points

T-4909

T-3002-M Manual Die Bonder

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equiped with Tresky's die ejector system for pick-up from wafer.

T-3002-M

T-3002-M

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