Options

Index: x : standard o : upgradable / Option (o) : on request, option model
    manual, eutectic, ultrasonic, die, bonder, T-4909 manual, eutectic, flip, chip, die, bonder, T-3002-M manual, eutectic, flip, chip, die, bonder, T-3000-FC3, manual, eutectic, flip, chip, die, bonder, T-3002-FC3   semi, automatic, eutectic, flip, chip, die, bonder, T-3202 full, fully, semi, auto, automatic, die, bonder T-6000  
Options / Features
Microscope Microscope o o o o   o
Process Camera Process Camera o o o   o
Beam Splitter Optic (Flip-Chip) Flip Chip o o o   o Flip-Chip, Flip, Chip, high accuracy, Bonder
Flip-Station Flip Station o o o   o o Flip-Chip, Flip, Chip, Flipping, Flipper, Bonder
500N High Bond Force Module o   high, bond, force, die, bonder
Bonding with defined epoxy thickness o o   x
Heating Eutectic o o o o   o o eutectic, die, bonder, preform, pre-form, pre, form, ultrasonic, heating, thermosonic
Ultrasonic Ultrasonic o o o o   o Ultrasonic, die, bonder, thermosonic
Stamping of Adhesives o o o o   o o
Dispensing x x x x   x x