DIE BONDER & COMPONENT PLACER

T-4909 Budget sensitive Manual Die Bonder

The T-4909 is a manual, high quality  die bonder with superior ergonomic design.  As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

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T-4909 Key Points

T-4909

T-3002-M Manual Die Bonder

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equiped with Tresky's die ejector system for pick-up from wafer.

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T-3002-M

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T-3000-FC3 Manual Bonder with semi auto. process capabilities

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

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T-3000-FC3

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T-3002-FC3 Manual DIE BONDER with semi auto. process capabilities

The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

The T-3002-FC3 is equiped with Tresky's die ejector system for pick-up from wafer.

manual, eutectic, flip, chip, die, bonder, T-3002-FC3,

T-3002-FC3

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