T-4909 Budget sensitive Manual Die Bonder

The T-4909 is a manual, high quality  die bonder with superior ergonomic design.  As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

T-3002-M Manual Die Bonder

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3002-M is equiped with Tresky's die ejector system for pick-up from wafer.

T-3002-M

T-3000-FC3 Manual Bonder with semi auto. process capabilities

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

T-3000-FC3

T-3002-FC3 Manual DIE BONDER with semi auto. process capabilities

The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

The T-3002-FC3 is equiped with Tresky's die ejector system for pick-up from wafer.

T-3002-FC3

T-3202 Semi Automatic Die Bonder

The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring a highest possible flexibility and enabling a cost effective solution of a broad variety of applications. As with all of Tresky’s products, this semi automatic die bonder , incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3202 is equiped with Tresky's die ejector system for pick-up from wafer.

T-3202

T-6000 Full Automatic Die Bonder

The T-6000 Die Bonder is an all purpose system for R&D, pilot and medium size production.
Die handling is standard from Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.

T-6000