General

Most RFID

(Radio-frequency identification) tags contain at least two parts. One is an integrated circuit for storing and processing information, modulating and demodulating a (RF) signal, and other specialized functions. The second is an antenna for receiving and transmitting the signal. Tresky’s modular die bonding equipment delivers, once more, optimal perfomance in R&D and pre-production assembly as e.g.: Bonding of a Flip-Chip to Antenna.

Flexibility

Tresky’s T-3000 line allows different RFID bonding processes, such as adhesive or ultrasonic bonding. Process parameters can be easely adjusted for optimized results. Temperature, time and force can be adjusted respectively programed independently.

Required Technical Data

Accuracy:

10micron (or less)

Bonding Parameters:

Force 20g - 400g and time up to 2-4sec. on final curing temperature.

Temperature:

Adjustable temp. profile for chip and antenna up to 200°C with ramping speed up to 18°C/Sec. for adhesive technologies only.

Various Processes

Process - Adhesive Tech. (ACP Anisotropic Conductive Paste)

Dispense ACP glue on antenna. Electroless bumped chip, aligned by beam splitter, placed into glue and cured.

Process - Adhesive Tech. (NCP Non Conductive Paste)

Dispense NCP glue on antenna. Stud bumped chip, aligned by beam splitter, placed into glue and cured.

Process - Ultrasonic

During placement, the ultrasonic energy is transfered to the chip contacts, where it is transformed into heat.

Tresky’s T-3000 Series modular line ...

... enables an easy changeover from one to another product within minimal steps, even between different process technologies, therefore ideal for R&D. The highly ergonomic and user friendly Tresky line is also suitable for medium production volume.