T-3202 Semi Automatic Die Bonder

The T-3202 represents a new generation of Windows operated, electronic assembly equipment, featuring a highest possible flexibility and enabling a cost effective solution of a broad variety of applications. As with all of Tresky’s products, this semi automatic die bonder , incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.

The T-3202 is equiped with Tresky's die ejector system for pick-up from wafer.

T-3202