Micro Assembly with motorized Bond Axis

T-3000-FC3 Manual Bonder with semi auto. process capabilities

The T-3000-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

manual, eutectic, flip, chip, die, bonder, T-3000-FC3,

T-3000-FC3

manual, eutectic, flip, chip, die, bonder, T-3000-FC3,

T-3002-FC3 Manual DIE BONDER with semi auto. process capabilities

The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.

The T-3002-FC3 is equiped with Tresky's die ejector system for pick-up from wafer.

manual, eutectic, flip, chip, die, bonder, T-3002-FC3,

T-3002-FC3

manual, eutectic, flip, chip, die, bonder, T-3002-FC3,