Micro Assembly Applications

A selection of some T-3000 series applications

Micro Assembly

MICRO ASSEMBLY PRODUCTS

A selection of some micro assembly products

  • T-6000L
  • Wafer

Rework

New: Flip-Chip Ultra Module

Tresky’s Flip-Chip Ultra module is a beam splitter optics, which allows the simultaneous viewing of two objects by an optical overlay (superposition) on the monitor. The Flip-Chip optics has a built-in Ultra HD camera with digital magnification as well as integrated LED lights for optimal illumination of various substrates and components. In combination with the high magnification and the XYTable micro positioning facility, high accuracy alignment can be reached.