Micro Assembly Applications

A selection of some T-3000 series applications

Micro Assembly


A selection of some micro assembly products


Automatic R&D Die- Bonder

The T-6000-L Die- Bonder is an all-purpose system for R&D, pilot and medium size production. It complements Tresky’s product line perfectly – highly universal – modular – easy to program.

Die handling is standard from Waffle-Pack, Gel-Pack and up to 8” Wafers. 

In addition to the automatic mode with pattern recognition, it has the ability to perform manual die bonding without extensive programming, making the system a reliable assistant for R&D as well.

Sophisticated accessories and rapid tool exchange with high-precision bonding and outstanding flexibility.

Tresky’s extensive options such as the stamping unit, as well as, the proven heating systems for eutectic processes are compatible with the T-6000, and widens the field of applications significantly.