Micro Assembly Applications
A selection of some T-3000 series applications
The T-6000L Die Bonder is a fully-automated all-purpose system for R&D, pilot and medium size production.
Equipped with linear motors and 0.1µm resolution glass scales, enable a precision of 8µm.
A force range of 20g to 800g (optional 10g to 5kg), combined with the large working area of 400 x 315mm
and wafer handling up to 8”, open a wide range of applications. With numerous available options,
the T-6000L can be customized to best suit your needs.