Tresky news

August News 2012

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NEW

REWORK HEAD MODULE FOR FC3

The Tresky’s rework head (RH) module can solder and desolder various kind of components by hot air. A solder removal module for site cleaning of the residual solder is available as well.
The XY -Table Micro Positioning Facility of the FC3 in combination with the beam Splitter allows high accuracy within critical applications.

JULY News 2012

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NEW

HIGH  SPEED AND ACCURATE, AUTOMATIC DIE BONDER T-8000

The T-8000 Die Bonder is an all purpose high accuracy system for R&D, pilot and medium size production. Die handling is standard from up to 12“ Wafer, Waffle-Pack and Gel-Pack. Automatic Die assembly utilizing pattern recognition is combined with ease of use operation and suited for manual single Die placement.

High Accuracy Full Automatic Die Bonder T-8000

T-8000

March News 2012

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International Sales Meeting 2012 

an exciting event


From March 6th to 8th 2012, Tresky could welcome its worldwide partners and representatives from more than 12 countries across the world, to the international sales meeting at the headquarters in Thalwil, Switzerland.


In addition to numerous presentations, Tresky presented the whole product range from manual to automated systems live. All machines where available for training and sample processing. Representatives and partner where able to receive training and profit from the active exchange of information.


At the end of informative and fruitful discussing days, the social event in the Swiss Alps was a welcome change and revealed further interesting discussions in a comfortable environment.


We would like to thank all visitors for the successful sales meeting. The numerous appearance has motivated us even more and shows that Tresky has established itself as a key player in the global semiconductor market.


International Sales Meeting 2012

January News 2012

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NEW

500N HIGH  BOND  FORCE  MODULE


High Bond Force (HF) module for TRESKY  T-3000  Series with 25Kg or 50Kg to meet various bonding technology requirements.  The sophisticated design of the HF-module in combination with the TRESKY True Vertical Technology ensures an absolute coplanarity between chip and substrate at any height and force during bonding process. The automated Z-Drive with bond force control enables a high repeatability of bond parameters.


High Bond Force, Die, Bonder, Thermocompresion

T-3000-FC3-HF

December News 2011

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Review 2011

An exciting year for Tresky


Tresky continued a substantial change process with major impact on the product portfolio and thus its brand recognition in 2011.

After having taken over the business from founder Dr. Tresky in 2007 the new management with CEO Thorleif Brandsberg and VP Alex Tresky has significantly been modernising the company’s appearance and step-by-step adapted and exceeded the product range.

Aiming to better meet the growing needs of our customers for automisation and also to address new markets Tresky launched the fully automated T-6000 Die Bonder at SMT Hybrid Packaging show in Nuremberg.

The US entry followed shortly after at APEX Expo Las Vegas.

Productronica 2011 in Munich was the highlight of Tresky’s trade shows for this year. We introduced the new tool holder for the T-6000 and received an extremely positive feedback on the live demonstration of our new flagship machine.

We also had the opportunity to present the new High Force Bonder T-3000-HF to public for the first time. Following the motto “The evolution of Bonding at Tresky” trade show visitors from all over the world were amazed to discover the “New Tresky”.

Publications in different media show that our competences being a full service solution provider for various needs for manual, semi-automated and fully automated production processes are being recognised.

We are happy that our customers are open to follow our new strategy and look forward to go further – Tresky: Just place it.

March News 2011

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NEW

Fully Automated Die Bonder T-6000

Flexibility is the key!


The T-6000 is the optimal compliment to Tresky’s product range in the field of automation. In addition to fully automated bonding with pattern recognition, the T-6000 also offers the possibility of manual die bonding operations without extensive programming.
All this, together with the proven manual and semi-automated bonders, Tresky is now able to provide complete solutions, from process development to production of small and medium volumes.
The numerous existing options such as the stamping unit, as well as the proven heating systems for eutectic and thermo compression processes are also compatible with the T-6000.

We are looking forward to presenting our innovative solutions!

Automatic Die Bonder T-6000

T-6000

 

Datasheet

 

Video

January News 2011

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NEW

Budget- Priced Manual Die-Bonder T-4909

The new Die-Bonder T-4909 has been introduced at the Photonics West 2011 exhibition in San Francisco. With this development, Tresky has extended its existing product portfolio in the budget sensitive range with a multifunctional DIE- Bonding machine. Due to the new concept that contains e.g. an air-cushion work stage with integrated XY micrometer control as well as an active force sensor, the price has been kept low. However, the familiar user-friendly and high-ranking quality standards of Tresky are always guaranteed! A fully programmable controller supports the operator during the process and allows precise setting of the various bonding parameters for reliable results.
Due to our 30-year experience in the development and manufacturing of Die-Bonders, approved technologies like the 360° spindle rotation and “True Vertical Technology™” have been maintained.

For this new machine series, following application packages are available:
-    Standard Pick and Place
-    Pick & Place with Dispenser or Stamping Option
-    Eutectic Package with Substrate Heating Plates and Tool Heating

 




manual, die, bonder, T-4909

T-4909