rework Applications
CHALLENGE QFN REWORK
Today’s requirements for professional repair and rework of QFN components (Quad Flat No leads), have SMD repair systems facing tough challenges. On one hand, QFN components are generally delivered without a solder ball/deposit and, on the other, the leads are located on the underside of the chip. Furthermore, QFN’s often have a large ground pad for their thermal management. Because of these specific features, a component the Rework-system has to have certain characteristics to ensure professional repair of the device.
