Hybrid & SMD Rework
T-Chipex1
System for removal of adhesive attached Semiconductor and SMD devices. It provides a fast and exact positioning of the component to be removed, pre-heating of the whole substrate, focused heating of the defective device and building-up of a shear force, necessary for the separation of the component. Depending on component size, the acting of the force can be static, dynamic or combined static and dynamic.
T-Chipex 1
R-System 1200
Tresky’s Rework System R-System 1200 is a stand alone easy to use system for nearly all SMT Rework applications with 1200W heating power. The precise placement supported by a split optic gives the possibility to rework all common components.
R-System 1200
