02. - 03. February 2010 Salesmeeting in USA
We are happy to announce the second member of our high quality and budget sensitive product line; A-Series.
The new "M-System1” for Die Attach.
click on picture for PDF
Tresky’s new stand alone manipulator “M-System1” is an easy to use system for a wide range of applicaions such as Die Attach and Pick & Place. The force controlled z-axis and the fine movement for x,y and theta in combination with the angle adjustable optics, makes it to an advanced assembly solution.
With the options; heated stage and dispenser, the M-System1 can be used as an epoxy die bonder and will be a great completion for all Wire-Bonder customers.
As from now the M-System1 is available to order.
After 28 years of intensive work, which was accompanied with much fun and excitement, the time has come to say thank you and hand the business over to the younger generation.Thank you to all customers, partners, employees and friends which contributed to our products and projects and spread this success in the field of the electronic industry wide into the world.
My stepping back from the operational business was accompanied by gradual preparation during the last few years and came to a completion during this year with various actions leading to a new company structure and organisation.
The company is managed now by Mr. Thorleif Brandsberg, which was leading the technical department previously for more then 4 years. Since one year, Mr. Brandsberg is in the position of the CEO and together with Alex Tresky, vice president since 15 years, I believe to leave the company in competent and strong hands. I am convinced that with the new team of leadership, the Dr. Tresky Company will continue to meet the needs of many customers and partners as well.
The divisions, sales and service, have been strengthened and newly structured. Sins the first of October we have an office in Berlin named Tresky Competence Centre. The persons in charge of the competence centre are: Mr. Daniel Schultze and Mr. Udo Hartwig. The distribution in the USA will remain as it is, directed by the Tresky Corporation in New Jersy.The head quarter, which meanwhile is enlarged and beautifully renovated, remains in Thalwil Switzerland.
To increase our productivity we invested in machinery; hereby we would like to point out our new precision CNC milling machine.It would be a great joy for me to see our customers remaining happy with the Tresky equipment and I am sure, other companies will get interested, especially in the products that are in progress today.
I wish the new Tresky team all the best, much success and joy in the coming future.
Dr. M. Tresky
Tresky’s NEW Rework System R-System600 and R-System1200 is a stand alone easy to use system for nearly all Rework applications. The precise placement supported by a split optic gives the possibility to rework all common components.
Applications: • µBGA, BGA, CSP
• QFP
• QFN, MLF
• Passive
• Shieldings…
Features: • Air flow Top Heater • Split optic
• Infrared Bottom Heater • Auto zoom camera
• Programmable Profiles • LED light
In the last months, Dr. Tresky AG has worked hard on a new business strategy. We made important strategical decisions to keep the sustainable development of our company and the business with you. As a first step, we are strengthening the relationship with our customers and expanding our global network.
We are pleased to announce the appointment of
Daniel Schultze as Sales Director and Udo Hartwig as Senior Engineer
Starting from October 1st, Daniel Schultze and Udo Hartwig will operate and lead our new
Tresky Competence Centre in Berlin / Germany
(Tel: +49 30 4303 2250 daniel.schultze@tresky.com udo.hartwig@tresky.com www.tresky.de )
Both, Daniel and Udo, are very experienced in the field of the micro electronic industry. These new members are complementing the Dr. Tresky team in an excellent way.
With this new arrangement we expect to increase the level of sales and maintain the good name of Dr.Tresky AG, plus expand our range of products.
We are convinced that the new team will make an excellent job, will contribute the company’s growth and supply the electronic industry with outstanding products.
T-3000-RD COMPONENT PLACER & DIE BONDER
BOND FORCE 1g up to 500N
Dr Tresky AG presents the new die bonder T-3000-RD, specially designed for research, development and professional training. The most remarkable features of this equipment are the integrated sensitive bond force measurement system and the high stability of the entire XYZ group. Depending on the application and settings, the vertical bond axis may be used for a bond force starting from 1g reaching up to 500N. Together with well proven Tresky options, this new die bonder is applicable for many bond methods such as Flip-Chip, Ultrasonic, Eutectic, Thermo Compression and others. The T-3000-RD is available with two or four guided axes. All axes are available in a manually operated version or motorized and programmable option. These versatile features are combined in an ergonomic design with a new appearance.
