UNIQUE WAFER PICK-UP
Contrary to conventional die bonding methods, separation of the die from the foil ensues trough the pull down of the foil, whereas the die supported by the non-movable needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts (vacuum tool, spindle, vacuum connector etc.) do not arise. This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick up tool and die ejector needle as well as increases the pick up reliability.
The advantage of this method is so significant, that delicate dies, which needed multiple needle ejector, can be picked-up by the standard die ejector. The stroke and the speed of the die ejector barrel are easily adjustable and can be done very quickly without the use of any tool.
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| Check out the Dr. Tresky AG Unique wafer pick-up. The advantage of this method is so significant! Download Quicktime Movie (mov) Download Windows Media File (wmf) |
USER FRIENDLY AND FLEXIBLE
Each of the Dr. Tresky machines is designed to be extremely flexible, with a wide range of add-ons. This makes them versatile enough to handle virtually any placement project; from the smallest die, to flip-chip, to various types of dispensing patterns, to a wide range of optic systems including a color video set. Flexibility, superior ergonomics and user-friendliness are comments we here from our global users on a continuing basis. Some unique features that make the Dr. Tresky equipment very flexible are:
- Illuminated, revolving work axis is located in a fixed XY position, which makes it user-friendly when using a microscope or camera.
- The ergonomically advantageous separation of the XY and Z movement with rotation reduces the danger of scratching components, increases positioning accuracy and makes the operation easier for the operator.
- Vacuum tool switches on or off automatically when the preset bonding force has been reached.