Die Bonder & Component Placer T-3002-FC3
T-3002-FC3 is equiped with wafer table and die ejector system.
T-3000-FC3 is designed to work on XY-table only.
A precise, high quality, versatile die bonder & component placer with superior ergononomic design and programmable, high accuracy Z-Drive and bonding force control.
Excellent performance, ergonomic design and high reliability make the T-3000-FC3 ideal for small and medium production and various development applications.
The automated Z-Drive with bond force control, enables a high repeatability of bond parameters.
The overlapping wafer & bonding levels reduce the necessary work-table movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels. Various video-systems are available for alignment (e.g. Flip-Chip).
TRESKY'S unique die ejector system
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.