Die Bonder & Component Placer T-3000-M
T-3002-M is equiped with wafer table and die ejector system.
T-3000-M is designed to work on XY-table only.
Excellent performance, ergonomically designed and high reliability make the T-3002-M ideal for small and medium production, runs with a cycle time of approx. 4 sec. (process depending) and various development applications.
The overlapping wafer & bonding levels reduce the necessary work - table movement to a minimum. The special automatic focusing facility compensates the difference between the two microscope working levels.
Various video-systems are available for alignment (e.g. Flip-Chip option).
The XY-wafer-table is located under the operation table. The XY-positioning knobs enable exact positioning of the dies. The right knob operates the Y-movement and has to be used only once per row. It serves for the adjustment of the whole row of dies and features an adjustable friction break to prevent an accidental shift of the position. Therefore the right hand is free for the operation of the work-table. The left hand knob, coaxial to the vertical movement knob, serves for positioning of single dies within one row.
TRESKY'S unique die ejector system
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.