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Micro Assembly Rework Concept Options Consumables System Archive
Headquarter Map Sales Europe Sales USA Sales USA Local Sales Asia Sales Australia
Customers
Hybrid MCM / COB SMD Flip - Chip RFID Opto Electronic Sensor Assembly 3D-Packaging Engineering
Die Bonder & Component Placer


T-3000-RD
HIGH ACCURACY PLACEMENT & BONDING
- Z -axis automated
- Digital controlled high bond force
- XY-work-table manual
Please, have a look at the T-3000-RD flyer  


M-System1
MANIPULATOR
- Z-axis manual (controlled)
- XY-work-table manual
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T-3002M
T-3002M MANUAL MULTI-APPLICATION-BONDER
- Z-axis manual with bond force module
- XY-work-table manual
- XY-wafer-table manual
pdf  Download Literature (Login required )


T-3002-FC3
T-3002-FC3 MANUAL MULTI-APPLICATION-BONDER
with semi automatic process capabilities
Z-axis automated with digital bond force
XY-worktable manual
XY-wafertable
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T-3202
SEMI-AUTOMATIC MULTI-APPLICATION-BONDER
XY-worktable and Z-axis automated
XY-wafertable manual
PC Windows operated
Camera controlled
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