die bonder, component placer, ejector, tresky, Dr Tresky AG Options

Micro Assembly Rework Concept Options Consumables System Archive

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Hybrid MCM / COB SMD Flip - Chip RFID Opto Electronic Sensor Assembly 3D-Packaging Engineering

Options

x : standard
o : upgradable / Option
(o) : on request, option model


Technical data
Work Table X movement (mm)	150	220	220	220	220	220	215	215	215		300	300	160
Work Table Y movement (mm)	150	220	220	220	220	220	215	215	215		260	260	160
Wafer stage 220 x 220 mm		o	x	o	x				x
Z-Movement (mm)	36	95	95	95	95	95	95	95	95		115	115	40
Pick-up Tool rotation (°)	360	360	360	360	360	270	360	270	360		ą10	ą10

Features

Dispensing of adhesives and solder pastes

o

x

x

x

x

x

x

x

SMD - Pick and Place ich

x

x

x

x

x

x

x

x

x

x

Bonding from Waffle-Packs

x

x

x

x

x

x

x

x

Bonding up to 8" Wafer

(o)

x

(o)

x

(o)

x

Filling of Waffle-Packs

x

x

x

x

x

x

x

Die Sorting

(o)

x

(o)

x

x

(o)

x

Bonding and Pick-up force induvidually prgrammable. Z-DC-Drive Management

x

x

x

x

x

XYZ-DC drive, PC supported "teach" - in programming

x

x

x

SMD Rework (solder in & out)

x

x

SMD & Hybrid Rework

x

Options

Microscop

o

o

o

o

o

o

o

o

o

Video Camera

x

o

o

o

o

o

o

o

o

x

x

o

Beam Splitter

x

x

Flip-Chip-Placement

Flip-Chip-IIa

o

o

o

o

o

o

o

Flip-Chip-IIb

o

o

o

o

o

o

o

Flip-Chip-IV

o

o

o

o

o

o

o

o

Flipstation

o

o

o

o

o

o

o

o

Bonding with defined epoxy thickness

o

o

x

x

x

x

High Bond Force

x

x

Eutectic Bonding

Heating Plate 62x62 mm

o

o

o

o

o

o

o

o

o

Heating Plate 100x100 mm

o

o

o

o

o

o

o

o

Quickheat

o

o

o

o

o

o

o

o

Tool Heating

o

o

o

o

o

o

o

o

o

Hot Jet

o

o

o

o

o

o

o

o

Scrub

o

o

o

o

o

o

o

o

Ultrasonic

o

o

o

o

o

o

o

o

Stamping of adhesives

o

o

o

o

o

o

o

o