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Micro Assembly Rework Concept Options Consumables System Archive
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Customers
Hybrid MCM / COB SMD Flip - Chip RFID Opto Electronic Sensor Assembly 3D-Packaging Engineering
SMD and HYBRID REWORK SYSTEMS


R-SYSTEM 600 / 1200
The Rework System R-System600 and R-System1200 is a stand alone easy to use system for nearly all SMD Rework applications. The precise placement supported by a split optic gives the possibility to rework all common components.
  


T-CHIPEX 1
The Hybrid Rework System T-Chipex 1 removes all glued dies from substrate.