Semi Automatic Die Bonder & Component Placer T-3202
T-3202 is equiped with wafer table and die ejector system.
T-3200 is designed to work on XY-table only.
The T-3200 and T-3202 represents a new generation of, Windows operated, electronics assembly equipment featuring a highest possible flexibility and enabling a cost effective solution of a broad variety of applications.
DR. TESKY AG introduces a new highly universal Die Attach System T-3200 and T-3202, designed for both development and lower or middle productions runs. It incorporates all experiences and know how gained in 25 years history of the company.
Flexible Windows based software and new highly accurate motion control, together with the proved feature of switching from automatic to manual operation at any time, provide easy teach-in programming, quick switch-over to another process and reproducible product quality.
Modular structure and a number of optional equipment enable optimal configuration for the user’s requirement, with the upgrade or retrofitting possibility any time.
TRESKY'S unique die ejector system
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.
The advantage of this method is so significant that delicate dies, which need multiple needle ejector, can be picked-up by the same standard die ejector. This die ejector is suitable especially for all kind of Si, GaAs and InP dies.
Contrary to conventional die bonding methods, separation of the die from the foil ensues through the pull down of the foil, whereas the die supported by the fixed needle remains stationary.
Therefore the usual dynamic forces arising through the acceleration of the die and all pick-up tool assembly parts, (vacuum tool, spindle, vacuum connector etc.) do not arise.
This property reduces the danger of die failure and surface damage, features higher alignment accuracy between the pick-up tool and die ejector needle as well as increasing pick-up reliability.
The stroke and the speed of the die ejector barrel is easily adjustable and can be done very quickly without use of a tool.