DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Die Bonding systems from Dr. Tresky are the first choice wherever the highest demands are placed on positioning accuracy, the fastest implementation of a wide variety of assembly processes and a wide range of technologies.

Our customers and industries, for which we develop and offer joint solutions, are just as diverse as our die bonder systems. This also applies to the various construction and connection technologies that have to be implemented.

Our development laboratory is available for this, together with the most modern analysis methods. Together with our highly qualified and experienced specialist staff, we can offer you a perfectly coordinated overall package that is tailored precisely to you and your requirements.

Customized solutions for individual applications

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