DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Manual micro assembly

T-4909-AE

Budget sensitive Manual Die Bonder

The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.

Download

Datasheet (PDF)

Video T-4909-AE

T-5100

PC controlled Manual Die Bonder

The T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.

The extremely rigid machine, with its completely redeveloped base is compact and fits on a lab desk. It can be expanded with many
different modules to cover an enormous range of applications.

Operating a Tresky die bonder/placer is intuitive. A few minutes’ training is sufficient to start working
with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of wellthought
out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution
optics that allow flip-chip placing down to sub-micron accuracy.

Download

Datasheet (PDF)

Video T-5100

T-5100-W

PC controlled Manual Die Bonder

Unique pick-up from wafer

The T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky’s pneumtatic die ejection system.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the T-5100-W incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the platform is the industry’s most sophisticated system in its class and with the new intuitive software even easier to operate.

Download

Datasheet (PDF)

Video T-5100-W

Any questions or interest in a online product demonstration?

Fabio Cocca - your sales contact at Dr. Tresky AG would be happy to talk to you personally. Give him a call or simply use our enquiry form.

+41 44 772 19 41

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