History

2021

New presentation of the 5000series, which replaces the quintessence of the consistent further development of the years-long successful models of the 3000series.

2020

The anniversary model T-4909-AE, Anniversary Edition on the occasion of the 40th anniversary of the Dr. Tresky AG is introduced.

2019

Presentation and launch of the new, further developed T-Suite software with extensive features for improved, more intuitive operation.

2018

Dr. Tresky AG launches the 3000-PRO series of semiautomatic die bonders.

2017

Dr. Tresky AG focusses on manual and semi manual equipment. The automation business has been sold to Tresky GmbH.
Tresky AG introduces the Flip Chip Ultra module.

2014

Additonal assembly floor space aquired for the automatic machines. Introduction of the High Force module for manual and semiautomatic machines.

2013

Introduction of the T-6000L with linear drives, higher precision and even more flexibility. Foundation of Tresky GmbH in Berlin for sales, support and engineering.
Daniel Schultze, Sales Director of Dr. Tresky AG becomes member of the management team at Tresky AG.

2012

Launch of the T-8000 automatic die bonder with large working area and 12" wafer handling.

2011

Cooperation with Hilpert Electronics in Switzerland. Worldwide sales of the automatic machine T-6000.

2007

Change of generations: Dr. M. Tresky retires from the operative business and hands over the management to Mr. Thorleif Brandsberg, General Manager / CEO and Mr. Alex Tresky / Vice President and member of the board.

2005

Introduction of the semi-automatic system T-3202 with Windows based control and 4 motorized axes.

2002

Foundation of Tresky Corporation in the USA and a development office in Prague CZ.

2000

Expansion of the office space and the production floor.

1998

The first semi-automatic system with motorized XY and Z-axes is introduced.

1996

A motorized Z-axis and a new frame concept is developed and forms the basis for the T-3000 machines series for up to 8“ and later up to 12“ wafer handling.

1994

Development of the manual machine T-3001 with wafer pickup.

1990

Conversion into the public limited company Dr. Tresky AG.

1987

The system T-4907 and the first rework machine T-4908 develops, both with specially made casted frames.

1984

Following the rapidly growing SMT market, Tresky introduces the models:
T-4905 and T-4906. These systems where first equiped with automatic vacuum switching and wafer pickup. The 4906 is sold in large quantities.

1983

Relocation to a larger facility and introduction of the first manual SMT Pick & Place machine T-4901.

1982

First TAB tester T-5201 is exhibited on Semicon in Zurich.

1980

Foundation of Dr. Tresky Engineering.