DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Dr. Tresky AG
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Anniversary offer | Die Bonder T-4909-AE

February, 02 2021

40 years in the market! This leaves behind amazement and grateful hearts. To say thanks to all customers we offer the new Diebonder T-4909-AE for a special anniversary price.

On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z-axis, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.

Interested? Click to get a quotation and download datasheet and

scroll down to see its unique qualities and perfected functionality in action!