Flip-Chip
Tresky’s Flip-Chip module for the T-5000 Series is a high-resolution placement unit with beam splitter, for ultra-precise Multi Point Alignment at sub-micron resolution. The beam splitter optics, which allows a simultaneous view of two objects by an optical overlay (superposition) on the monitor.
The Flip-Chip optics has a built-in Ultra HD camera with digital magnification as well as integrated LED lights for optimal illumination of various substrates and components. In combination with the high magnification, the XY-Table Micrometer positioning facility and the Tresky’s True Vertical Technolgy™ a high accuracy alignment can be reached. With the easy to use software T-Suits all the nessessary camera paramets, up-, down-, coax-light can be set for each position as well measuerements, saving images for documentation, additional layouts overlayed and much more.
Technical Specification:
Flip-Chip MPA 5000-M 2x
- High prec. beam splitter with 2x high resolution optic
- 400x digital zoom Ultra HD camera
- 50mm x 50mm Multi-Point Alignment for high accuracy
- Optical Resolution of 0.625µm
- Field of view 0,6x0.5mm – 3,3x2.5mm
- White-LED illumination (up, down and coax)
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