Ultrasonic bonding head
The ultrasonic unit extends the range of application of Dr. Tresky AG Chip Bonders to include thermal and ultrasonic applications. The digital generators have an adjustable power up to 40W or for higher demands up to 100W at a frequency of 90kHz. The ultrasonic transducer is mounted on the rotating spindle with a few hand movements, which guarantees a flexible use.
All Dr. Tresky machines can be equipped with an ultrasonic unit.
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