UV curing unit
The UV curing unit is designed for fast UV adhesive curing during the bonding process on the Chip Bonder machine. A high-end light source and the automatic cover of the dispensing needle are included with this option. The field of application is wide and includes both micro-component and optical component connections such as glass fibres, VCSELs and photodiodes.
All Tresky machines can be equipped with a UV curing unit.