DR. TRESKY AG - Die Bonder / Micro Assembly Solutions
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Flip-Station for Dies

The Tresky DIE Flip - Station is designed to minimize the mechanical stress on the Chip to avoid any damage. The soft flipping of the die upside down is gently controlled and can be activated manually or automatically. An exchangeable tip and support plate allows to handle a wide range of die sizes (down to 0.250mm). The adjustable speed and height gives you the most possible flexibility to flip a die.

It's possible to flip any devices. Tool change is very simple.

All T-5000 Series models can be upgraded with the die flip-station.

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Datasheet (PDF)

Tresky AG flip station for die bonding